MiniPIX
Technical Specs Sensor Material: Si Sensor Thickness: 300 μm, 500 μm and 675 μm for Si Sensitive Area: 14 mm X 14 mm Readout Speed: 30 frames/s&n
- Model：
| Technical Specs | |
| Sensor Material: | Si |
| Sensor Thickness: | 300 μm, 500 μm and 675 μm for Si |
| Sensitive Area: | 14 mm X 14 mm |
| Readout Speed: | 30 frames/s |
| Connectivity: | USB 2.0 |
| Number of Pixels: | 256 X 256 |
| Pixel Pitch: | 55 μm |
| Pixel Mode of Operation: | Counting, Time-over-Threshold, Time-of -Arrival |
| Minimum Detectable Energy: | 5 keV for X-rays |
| Threshoid Step Resolution: | 0.1 keV |
| Energy Resolution: | 0.8 keV (THL) and 2 keV (ToT) |
| Pixel Photon Counting Speed: | 1e5 photons/s/pixel |
| Readout Chip: | Timepix |
| Resolution: | 9 lp/mm |
| Weight: | 50 g |
| Dimensions: | 60 mm x 12 mm x 5 mm (L x W x H) |
| Software: | Pixet and Pixelman |