FitPIX kit
Technical Specs Sensor Material: Si or CdTe Sensor Thickness: 300 μm, 500 μm and 675 μm for Si; 1 mm for CdTe Sensitive Area: 14 mm X 14 mm Readout Sp
- Model:
Technical Specs Sensor Material: Si or CdTe Sensor Thickness: 300 μm, 500 μm and 675 μm for Si; 1 mm for CdTe Sensitive Area: 14 mm X 14 mm Readout Sp
Technical Specs | |
Sensor Material: | Si or CdTe |
Sensor Thickness: | 300 μm, 500 μm and 675 μm for Si; 1 mm for CdTe |
Sensitive Area: | 14 mm X 14 mm |
Readout Speed: | 100 frames/s (single layer1) |
Connectivity: | USB 2.0 |
Vacuum compatible: | Yes |
Number of Pixels: | 256 X 256 |
Pixel Pitch: | 55 μm |
Pixel Mode of Operation: | Counting, Time-over-Threshold, Time-of -Arrival |
Minimum Detectable Energy: | 5 keV for X-rays |
Threshoid Step Resolution: | 0.1 keV |
Energy Resolution: | 0.8 keV (THL) and 2 keV (ToT) |
Pixel Photon Counting Speed: | 1e5 photons/s/pixel |
Readout Chip: | Timepix |
Resolution: | 9 lp/mm |
Weight: | 0.2 kg |
Software: | Pixet and Pixelman |
1The maximal frame-rate decreases with number of stacked detector layers.